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US 2012/0074591 A1Published application
Thin wafer support assembly
AssigneeVarian Semiconductor Equipment Associates, Inc.
InventorArthur Paul Riaf
Life of this patent
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Abstract
A semiconductor wafer assembly formed by bonding a support wafer to a thin wafer using a double-sided bonding release tape. The support wafer provides support for the thin target wafer such that existing handling tools can accommodate transporting and processing the assembly without compromising the profile of the thin target wafer.
Claims10
A semiconductor wafer assembly for processing substrates comprising:
- a support wafer;
- and
- a thin target wafer bonded to said support wafer using a double-sided release tape disposed therebetween, said release tape having a release temperature at which said bond between the support wafer and the thin target wafer is released.
A method of bonding a support wafer to a target thin wafer comprising:
- exposing a first side of a double sided release tape;
- attaching an upper surface of a support wafer to the first side of the double sided release tape;
- exposing a second side of the double sided release tape;
- and
- attaching a bottom surface of a thin target wafer to the second side of the double sided release tape such that said the support wafer and thin target wafer are bonded together.
2 more elements
A vacuum chamber for forming a semiconductor wafer assembly comprising:
- a first pedestal configured for vertical displacement within said chamber, said pedestal having a surface for supporting a support wafer and a bonding release tape;
- and
- a second pedestal configured to support a target thin wafer,
- wherein said first pedestal is vertically displaced to couple the support wafer and the target thin wafer with the bonding release tape therebetween.
1 more element
Dependencies are inferred from the claim text.