Crack stop structure enhancement of the integrated circuit seal ring
AssigneeChartered Semiconductor Manufacturing Ltd.
InventorsAlfred Yeo, Kai Chong Chan
Life of this patent
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Abstract
An improved crack stop structure (and method of forming) is provided within a die seal ring of an integrated circuit die to increase crack resistance during the dicing of a semiconductor wafer. The crack stop structure includes a stack layer (of alternating insulating and conductive layers) and an anchor system extending from the stack layer to a predetermined point below the surface of the substrate. A crack stop trench is formed in the substrate and filled with material having good crack resistance to anchor the stack layer to the substrate.
Claims21
-9. (canceled)
A semiconductor die having a crack stop structure adjacent an active area, the crack stop structure comprising:
- a stacked layer having a plurality of alternating insulating layers and conductive layers;
- and
- an anchor system including at least one anchor having a first portion embedded within a substrate of the semiconductor die and having a second portion coupled to a one of the conductive layers for attaching the stacked layer to the substrate.
A semiconductor wafer comprising:
- a substrate;
- and
- a plurality of integrated circuit dies, each integrated circuit die including a die seal ring adjacent an active area, the die seal ring including a crack stop structure, the crack stop structure comprising:
- a stack layer overlying the substrate, and
- an anchor system coupled to the stack layer and extending from the stack layer to a point below a surface of the substrate.
A semiconductor device, comprising:
- a first insulating layer overlying a substrate, the substrate having an active area in which one or more doped regions form at least a part of an active device within the active area;
- an anchor extending through the first insulating layer and having at least a portion thereof of a first predetermined material disposed within a crack stop trench within the substrate;
- and
- a stacked layer overlying the first insulating layer, the stacked layer including at least a first conductive layer and a second insulating layer overlying the first conductive layer.
Dependencies are inferred from the claim text.