Led package module and manufacturing method thereof
AssigneeAmTRAN Technology Co., Ltd.
InventorWei Jen Chou
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Abstract
A light emitting diode (LED) package module and the manufacturing method thereof are presented. A plurality of LEDs and a plurality of semiconductor elements are disposed on a silicon substrate, and then a plurality of lenses is formed above the positions of the plurality of the LEDs, and the plurality of the lenses is corresponding to the plurality of the LEDs. Then, a plurality of package units is defined on the silicon substrate, and each package unit has a semiconductor element and at least one LED. After that, the silicon substrate is cut to form a plurality of LED package modules, and each LED package module has at least one package unit.
Claims20
A manufacturing method of a light emitting diode (LED) package module, comprising:
- providing a silicon substrate;
- electrically disposing a plurality of LEDs on the silicon substrate;
- electrically disposing a plurality of semiconductor elements on the silicon substrate;
- forming a plurality of lenses above positions of the plurality of LEDs, wherein the plurality of lenses are respectively corresponding to the plurality of LEDs;
- defining a plurality of package units on the silicon substrate, wherein each package unit has a semiconductor element and at least one LED;
- and
- cutting the silicon substrate, to form a plurality of LED package modules, wherein each LED package module has at least one package unit.
A light emitting diode (LED) package module, comprising:
- a silicon substrate;
- and
- at least one package unit, electrically disposed on the silicon substrate, and having at least one LED, a semiconductor element, and a layer of encapsulant, wherein the layer of encapsulant encapsulates the LED and the semiconductor element, the layer of encapsulant has at least one lens, disposed above the LED and corresponding to the LED vertically.
A light emitting diode (LED) package module, comprising:
- a silicon substrate;
- and
- at least one package unit, electrically disposed on the silicon substrate, and having at least one LED, a semiconductor element, and a plurality of encapsulants, wherein the plurality of encapsulants respectively encapsulates the at least one LED and the semiconductor element, and at least one of encapsulants has a lens, disposed above the at least one LED and corresponding to the at least one LED vertically.
Dependencies are inferred from the claim text.