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US 2012/0069525 A1Published application
Assembled structure of electronic component and heat-dissipating device
AssigneeDelta Electronics, Inc.
InventorMing-Tang Yang
Life of this patent
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AssigneeDelta Electronics, Inc.
InventorMing-Tang Yang
Estimating the term…
An assembled structure includes an electronic component, a heat-dissipating device and a stepped isolation member. The electronic component has a first perforation. The heat-dissipating device has a second perforation corresponding to the first perforation of the electronic component. The stepped isolation member includes a first segment, a second segment and a third segment. The outer diameter of the first segment is smaller than the outer diameter of the second segment, and the outer diameter of the second segment is smaller than the outer diameter of the third segment. The first segment is partially accommodated within the first perforation of the electronic component, the second segment is arranged between the first segment and the third segment and engaged with the second perforation of the heat-dissipating device, and the third segment is contacted with the heat-dissipating device.
An assembled structure, comprising:
A stepped isolation member for use in an assembled structure of an electronic component and a heat-dissipating device, said electronic component having a first perforation, said heat-dissipating device having a second perforation corresponding to said first perforation, said stepped isolation member comprising:
Dependencies are inferred from the claim text.