Mems integrated chip with cross-area interconnection
AssigneePixArt Imaging Inc., R.O.C.
InventorsHsin-Hui Hsu, Chuan-Wei Wang, Sheng-Ta Lee
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Abstract
The present invention discloses a MEMS (Micro-Electro-Mechanical System) integrated chip with cross-area interconnection, comprising: a substrate; a MEMS device area on the substrate; a microelectronic device area on the substrate; a guard ring separating the MEMS device area and the microelectronic device area; and a conductive layer on the surface of the substrate below the guard ring, or a well in the substrate below the guard ring, as a cross-area interconnection electrically connecting the MEMS device area and the microelectronic device area.
Claims19
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A MEMS integrated chip with cross-area interconnection, comprising:
- a substrate;
- a MEMS device area on the substrate;
- a microelectronic device area on the substrate;
- a guard ring separating the MEMS device area and the microelectronic device area;
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- a conductive layer on a surface of the substrate below the guard ring, as a cross-area interconnection electrically connecting the MEMS device area and the microelectronic device area.
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Dependencies are inferred from the claim text.