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US 2011/0298108 A1Published application
Non-leaded integrated circuit package system with multiple ground sites
AssigneeSTATS ChipPAC, Ltd.
InventorsJeffrey D. Punzalan, Byung Tai Do, Henry D. Bathan, Zigmund Ramirez Camacho
Life of this patent
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Abstract
A non-leaded integrated circuit package system includes: a die paddle of a lead frame; a dual row of terminals including an outer terminal and an inner terminal; and an inner terminal and an adjacent inner terminal to form a fused lead.
Claims10
A non-leaded integrated circuit package system comprising:
- a die paddle of a lead frame;
- a dual row of terminals including an outer terminal and an inner terminal;
- and
- an inner terminal and an adjacent inner terminal to form a fused lead.
1 more element
Dependencies are inferred from the claim text.