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US 2011/0236171 A1Published application
Workpiece transport method and workpiece transport device
OwnerMasayuki Yamamoto, Chouhei Okunoinventors
Life of this patent
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Abstract
Two or more pads having through holes formed therein concentrically at given pitches are provided on a U-shaped holding arm. Compressed air is sprayed from the pad to a protection sheet to generate negative pressure between a holding surface of the holding arm and the protection sheet for suspendingly holding a wafer with the protection sheet floating, or the pad suction-holds and transports a rear face of the wafer having an exposed circuit surface.
Claims12
A workpiece transport method for transporting a workpiece, comprising the step of:
- transporting the workpiece through switching to suction-holding of the workpiece on a holding surface of a holding member in accordance with the workpiece, or to suspendingly holding of the workpiece while floating due to negative pressure generated between the holding surface and a surface of the wafer through spraying compressed air from the holding surface of the holding member to the workpiece.
A workpiece transport device for transporting a workpiece, comprising:
- a holding member for holding the workpiece;
- a compressor in communication with the holding member via a channel;
- and
- a controller for performing switching control of the compressor so as to spray compressed air toward the workpiece from a holding surface of the holding member to generate negative pressure between the holding surface and the workpiece for suspendingly holding and transporting the workpiece, or to suction-hold the workpiece with the holding arm for transporting the workpiece.
1 more element
Dependencies are inferred from the claim text.