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US 2011/0214902 A1Published application
Package structure and electronic apparatus of the same
AssigneeAmazing Microelectronic Corp.
InventorsHo-Shyan Lin, Tsu-Yang Wong
Life of this patent
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Abstract
A package structure and an electronic apparatus of the package structure are disclosed. The package structure includes a substrate and a plurality of pins. The plurality of pins is disposed on the substrate. The plurality of pins is interlaced to each other, so that a line along a specific direction will only pass one of the plurality of pins at most.
Claims10
A package structure, comprising:
- a substrate;
- and
- a plurality of pins, disposed on the substrate, the plurality of pins being interlaced to each other, so that a line along a specific direction only passing one of the plurality of pins at most.
An electronic apparatus, comprising:
- a package structure, comprising:
- a substrate;
- and
- a plurality of pins, disposed on the substrate, the plurality of pins being interlaced to each other, so that a line along a specific direction only passing one of the plurality of pins at most.
1 more element
Dependencies are inferred from the claim text.