Assessing metal stack integrity in sophisticated semiconductor devices by mechanically stressing die contacts
AssigneeGlobalfoundries Inc.
InventorsHolm Geisler, Matthias Lehr, Frank Kuechenmeister, Michael Grillberger
Life of this patent
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Abstract
The metallization system of complex semiconductor devices may be evaluated in terms of mechanical integrity on the basis of a measurement system and measurement procedures in which individual contact elements, such as metal pillars or solder bumps, are mechanically stimulated, while the response of the metallization system, for instance in the form of directly measured forces, is determined in order to quantitatively evaluate mechanical status of the metallization system. In this manner, the complex material systems and the mutual interactions thereof may be efficiently assessed.
Claims21
A method, comprising:
- inducing mechanical stress in a dielectric material of a metallization system of a semiconductor device by applying a mechanical force to an individual chip contact element formed in said metallization system and extending above a surface of said dielectric material;
- and
- determining at least one parameter value indicative of a response of said dielectric material to said induced mechanical stress.
A method, comprising:
- determining a critical force required to create a non-reversible deformation of a dielectric material of a metallization system of a semiconductor device by applying a force to a chip contact element formed in said metallization system;
- and
- using said critical force so as to assess a mechanical stability of said metallization system.
A measurement system, comprising:
- a probe configured to individually apply a force to a chip contact element formed in a metallization system of a semiconductor device;
- and
- a detection system configured to provide at least one parameter value indicative of a mechanical response of said metallization system to said force applied to said chip contact element.
Dependencies are inferred from the claim text.