Heatsink and method of fabricating same
AssigneeGeneral Electric Company
InventorsRichard Alfred Beaupre, Ljubisa Dragoljub Stevanovic, Dieter Gerhard Brunner
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Abstract
A heatsink assembly for cooling a heated device includes a ceramic substrate having a plurality of cooling fluid channels integrated therein. The ceramic substrate includes a topside surface and a bottomside surface. A layer of electrically conducting material is bonded or brazed to only one of the topside and bottomside surfaces of the ceramic substrate. The electrically conducting material and the ceramic substrate have substantially identical coefficients of thermal expansion.
Claims21
A heatsink assembly for cooling a heated device comprising:
- a layer of electrically isolating material comprising cooling fluid channels integrated therein, the layer of electrically isolating material comprising a topside surface and a bottomside surface;
- and
- a layer of electrically conducting material bonded or brazed to only one of the topside and bottomside surfaces of the ceramic layer to form a two-layer substrate.
A heatsink assembly for cooling a heated device comprising:
- a ceramic substrate comprising a plurality of cooling fluid channels integrated therein, the ceramic substrate comprising a topside surface and a bottomside surface;
- and
- a layer of electrically conducting material bonded or brazed to only one of the topside and bottomside surfaces of the ceramic substrate.
Dependencies are inferred from the claim text.