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US 2010/0302730 A1Published application
Use of vortex generators to improve efficacy of heat sinks used to cool electrical and electro-optical components
AssigneeAlcatel Lucent
InventorDomhnaill Hernon
Life of this patent
Estimating the term…
Abstract
Use of vortex generators to improve efficacy of heat sinks used to cool telecommunications, electrical and electro-optical components.
Claims20
An apparatus, comprising:
- at least one heat sink including a plurality of cooling fins for cooling at least one heat generating component;
- and
- at least one vortex generator, positioned upstream of said at least one heat sink in relation to a cooling fluid flow presented to said at least one heat sink such that at least one vortex having an unsteady flow is imparted to the cooling fluid flow proximate the surfaces of said plurality of cooling fins of said at least one heat sink to reduce thereby the thermal resistance of said at least one heat sink.
A method, comprising:
- disposing at least one heat sink including a plurality of cooling fins in thermal communication with at least one heat generating component of a circuit pack;
- providing at least one source for a cooling fluid flow directed towards said at least one heat sink;
- and
- disposing at least one vortex generator on said circuit pack upstream of said at least one heat sink in relation to the cooling fluid flow presented to said at least one heat sink such that at least one vortex having an unsteady flow is imparted to the cooling fluid flow proximate the surfaces of said plurality of cooling fins of said at least one heat sink to reduce thereby the thermal resistance of said at least one heat sink.
1 more element
A system, comprising:
- a circuit pack having at least one heat generating component;
- at least one heat sink including a plurality of cooling fins in thermal communication with said at least one heat generating component;
- at least one cooling fluid flow directed towards said at least one heat sink;
- and
- at least one vortex generator disposed on said circuit pack upstream of said at least one heat sink in relation to the cooling fluid flow directed towards said at least one heat sink such that at least one vortex having an unsteady flow is imparted to the cooling fluid flow proximate the surfaces of said plurality of cooling fins of said at least one heat sink to reduce thereby the thermal resistance of said at least one heat sink.
2 more elements
Dependencies are inferred from the claim text.