Wafer mounting method and wafer mounting apparatus
OwnerMasayuki Yamamoto, Yukitoshi Haseinventors
Life of this patent
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Abstract
A reinforcing support substrate is joined to a surface of the semiconductor wafer via a double-faced adhesive tape, and then is removed from the semiconductor wafer. Subsequently, the semiconductor wafer with the support substrate removed therefrom is adhesively held on a rear face of a ring frame via a support adhesive tape, and the double-faced adhesive tape is separated from the surface of the semiconductor wafer integrate with the ring frame.
Claims8
A method of mounting a semiconductor wafer on a ring frame via a support adhesive tape for adhesively holding the semiconductor wafer, comprising the steps of:
- removing a reinforcing support substrate joined to a surface of the semiconductor wafer via a double-faced adhesive tape from the semiconductor wafer;
- mounting the semiconductor wafer with the support substrate removed therefrom to a rear face of the ring frame via the support adhesive tape for adhesively holding the semiconductor wafer;
- and
- separating the double-faced adhesive tape from the surface of semiconductor wafer integral with the ring frame.
An apparatus for mounting a semiconductor wafer for adhesively holding the semiconductor wafer on a ring frame via a support adhesive tape, comprising:
- a removing table to adhesively hold the semiconductor wafer on a support substrate via a double-faced adhesive tape;
- a substrate removing device to remove the support substrate with the double-faced adhesive tape remaining on the semiconductor wafer;
- a wafer transport mechanism to transport the semiconductor wafer held on the removing table in a planar state;
- an aligner to align the semiconductor wafer in a planar state that is transported by the wafer transport mechanism;
- a chuck table to receive the semiconductor wafer transported together with the aligner in a planar state;
- a joining mechanism to join the support adhesive tape over the semiconductor wafer held by the chuck table and the ring frame;
- and
- a tape separation mechanism to separate the double-faced adhesive tape from the semiconductor wafer integral with the ring frame via the adhesive tape.
Dependencies are inferred from the claim text.