Method for applying coating liquid, method for forming coated film, method for forming a pattern by using the same, and method for manufacturing semiconductor device

Abstract

Described are novel methods for applying a coating liquid, forming a coated film, forming a pattern by using the same, and manufacturing a semiconductor device. A coating liquid is applied onto a substrate using a method including forming a puddle of a mixture liquid containing a coating liquid and a diluting liquid on the substrate and spreading the mixture liquid over the surface of the substrate, forming a coated film. Alternatively, a coating liquid is applied onto a substrate using a method including dispensing a diluting liquid on a substrate to cover the entire surface of the substrate with the diluting liquid, dispensing a coating liquid on the diluting liquid forming an area where the mixture liquid containing the coating liquid and the diluting liquid is present, and spreading the mixture liquid over the surface of the substrate to apply the coating liquid on the substrate, forming a coated film.

Dependencies are inferred from the claim text.