Active device array substrate

An active device array substrate, having a display area and an adjacent peripheral circuit area, the active device array substrate comprising:

• an active matrix device, disposed in the display area;
• a plurality of first bonding pads, disposed in the peripheral circuit area and electrically connected to the active matrix device;
• a plurality of second bonding pads, disposed in the peripheral circuit area and electrically insulated from the first bonding pads;
• a plurality of test bonding pads, disposed in the peripheral circuit area between the second bonding pads and the first bonding pads, and separated from the second bonding pads, wherein each of the test bonding pads is corresponding to one of the second bonding pads;
• a plurality of switch devices, disposed in the peripheral circuit area between the test bonding pads and the first bonding pads, and electrically connected to the test bonding pads;
• a test signal pad, disposed in the peripheral circuit area, and electrically connected to the switch devices, for inputting or outputting a test signal;
• a switch device control pad, disposed in the peripheral circuit area, and electrically connected to the switch devices, for turning on or off the switch devices;
• and
• at least one driving chip, electrically connected to the first bonding pads, the second bonding pads, and the test bonding pads.