Mask verification method, method of manufacturing semiconductor device, and computer readable medium

A method of manufacturing a semiconductor device, comprising:

• setting optical parameters at a time of transfer such that a pattern, which is obtained when a reference pattern that is selected from among patterns on a mask is transferred on a substrate, satisfies a target dimensional condition;
• verifying whether a pattern, which is obtained when a mask pattern other than the reference pattern of the patterns on the mask is transferred on the substrate with use of the set optical parameters, satisfies dimensional specifications;
• varying, when the pattern which is obtained when the mask pattern is transferred on the substrate is determined to fail to satisfy the dimensional specifications, the optical parameters at the time of transfer such that the pattern, which is obtained when the reference pattern is transferred on the substrate, satisfies the target dimensional condition, verifying whether a pattern, which is obtained when the mask pattern other than the reference pattern of the patterns on the mask is transferred on the substrate with use of the varied optical parameters, satisfies the dimensional specifications, and repeating the varying of the optical parameters until a verification result which satisfies the dimensional specifications is obtained;
• and
• transferring the pattern on the mask onto the substrate by using the optical parameters which satisfy the dimensional specifications.

A computer readable medium configured to store program instructions, which causes a computer to execute:

• setting optical parameters which become an exposure condition at a time of transfer such that a pattern, which is obtained when a reference pattern that is selected from patterns on a mask is transferred on a substrate, satisfies a target dimensional condition;
• verifying whether a pattern, which is obtained when a mask pattern other than the reference pattern of the patterns on the mask is transferred on the substrate with use of the set optical parameters, satisfies dimensional specifications;
• and
• setting the optical parameters when the pattern which is obtained when the mask pattern is transferred is determined to satisfy the dimensional specifications, varying, when the pattern which is obtained when the mask pattern is transferred is determined to fail to satisfy the dimensional specifications, the optical parameters at the time of transfer such that the pattern, which is obtained when the reference pattern is transferred on the substrate, satisfies the target dimensional condition, verifying whether a pattern, which is obtained when the mask pattern other than the reference pattern of the patterns on the mask is transferred on the substrate with use of the varied optical parameters, satisfies the dimensional specifications, and repeating the varying of the optical parameters until a verification result which satisfies the dimensional specifications is obtained.