Multiphase synchronous buck converter

A process for forming a packaged multiphase buck converter, comprising the steps of:

• providing a lead frame comprising a plurality of leads, a first die attach pad, a second die attach pad integral with the first die attach pad, and a third die attach pad, each of which is electrically connected to the others, wherein the first and second pads are in a first plane, the second die attach pad and third die attach pad being connected by a conductive bridge, the third die attach pad having a first lead;
• mounting a first die, with a first source, a first gate, and a first drain, to the first die attach pad such that the first drain is electrically connected to the first die attach pad, and thus to the first lead;
• mounting a second die, with a second source, a second gate, and a second drain, to the third die attach pad such that the second source is electrically connected to the third die attach pad, and thus to the first lead;
• mounting a fourth die attach pad to the second drain, the fourth die attach pad having a second lead;
• bending the bridge such that the first and second leads contact the plurality of leads, and disposes the third die attach pad in a second plane parallel, but separated from, the first plane;
• mounting a fifth die attach pad, with a third lead to the first source such that the third lead contacts the plurality of leads;
• mounting a fourth lead to the first gate, the fourth lead contacting the plurality of leads;
• mounting a fifth lead to the second gate, the fifth lead contacting the plurality of leads;
• mounting a third die, with a third source, a third gate, and a third drain, to the second die attach pad such that the third drain electrically contacts the first drain through the first and second die attach pad;
• mounting a fourth die with a fourth source, a fourth gate, and a fourth drain to a sixth die attach pad with a sixth lead such that the fourth drain contacts the sixth lead;
• mounting the sixth die attach pad to the lead frame such that the third source contacts the sixth lead which contacts the plurality of leads;
• mounting a seventh lead to the fourth gate, the seventh lead contacting the plurality of leads;
• mounting a eighth lead to the third gate, the eighth lead contacting the plurality of leads;
• and
• mounting a seventh die attach pad with a ninth lead to the lead frame such that the fourth source contacts the ninth lead which contacts the plurality of leads.