Methods of calculating thicknesses of layers and methods of forming layers using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsHo-Ki Lee, Sung-Ho Han, Yong-Jin Kim
Life of this patent
Estimating the term…
Loading patent…
AssigneeSamsung Electronics Co., Ltd.
InventorsHo-Ki Lee, Sung-Ho Han, Yong-Jin Kim
Estimating the term…
A method of calculating a thickness of a layer may include forming the layer on a substrate in a chamber, measuring optical emission spectrum data from the chamber, and calculating the thickness of the layer from the optical emission spectrum data. A method of forming a layer may include depositing the layer on a substrate in a chamber, measuring optical emission spectrum data from the chamber, calculating a thickness of the layer using the optical emission spectrum data, and ending the depositing of the layer when the calculated thickness of the layer is within a target thickness range.
A method of calculating a thickness of a layer, comprising:
A method of forming a layer, comprising:
Dependencies are inferred from the claim text.