System and method for separating defective dies from wafer
AssigneeCheng Mei Instrument Technology Co., Ltd.
InventorsTE CHUN CHEN, CHIEN CHAO HUANG, CHENG TAO TSAI
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Abstract
A system separating defective dies from a wafer comprises a film frame platform and a pick-and-place device. The film frame platform comprises a support table assembly configured for supporting a film frame assembly and a platform surface configured to receive the placement of bins thereupon. The pick-and-place device is configured for moving in a linear manner between the support table assembly and the platform surface.
Claims21
A system for separating defective dies from a wafer, the system being configured for picking and placing defective dies from a film frame assembly to a bin, and comprising:
- a film frame platform comprising a support table assembly and a platform surface adjacent to the support table assembly, the support table assembly configured to support the film frame assembly, and the platform surface configured to place the bin;
- and
- a pick-and-place device configured to move in a linear manner between the support table assembly and the platform surface.
A method for separating defective dies from a wafer, comprising the steps of:
- obtaining a defect map of a wafer from a film frame assembly, wherein a film frame platform comprises a support table assembly and a platform surface adjacent to the support table assembly, and the film frame assembly is supported by the support table assembly;
- and
- removing defective dies from the film frame assembly to a bin placed on the platform surface by using a linear motion device and in accordance with the defect map.
Dependencies are inferred from the claim text.