Airflow conducting apparatus
AssigneeHon Hai Precision Industry Co., Ltd.
InventorsHO-CHIN TSAI, LUNG-SHENG TSAI, LI-PING CHEN, YI-LUNG CHOU
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Abstract
An airflow conducting apparatus is used for dissipating heat from at least one memory module received in a corresponding socket on a motherboard. The airflow conducting apparatus includes an airduct and a valve piece. The airduct is positioned over the socket and configured to guide air to flow therethrough. The valve piece is attached to an inside of the airduct. The valve piece includes a plurality of parallel elastic flaps. Each flap has at least one configuration that deflects air flowing through the airduct.
Claims12
An airflow conducting apparatus for dissipating heat from at least one memory module received in a corresponding socket on a motherboard, the airflow conducting apparatus comprising:
- an airduct positioned over the socket and configured to guide air to flow therethrough, a plurality of holes defined in the airduct;
- and
- a valve piece attached to an inside of the airduct, the valve piece comprising a plurality of substantially parallel elastic flaps and hooks, each flap having at least one configuration that deflects air flowing through the airduct, each hook extends into a corresponding one of the plurality of holes.
A computer comprising:
- a motherboard comprising a socket arranged along a first direction;
- a memory module received in the socket;
- and
- a valve piece comprising a first elastic flap, the first flap positioned at a lateral side of the memory module having at least one configuration that deflects air flowing along the first direction towards the memory module;
- wherein the valve piece further comprises a second flexible flap, and the second flap is deformed to a planar shape by a top surface of the memory module.
Dependencies are inferred from the claim text.