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US 2010/0165316 A1Published application
Inclined exposure lithography system
AssigneeIndustrial Technology Research Institute
InventorsYING-JUI HUANG, Cheng-Hsuan Lin, Fuh-Yu Chang
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Abstract
An inclined exposure lithography system is disclosed, which comprises: a substrate; a photoresist layer, formed on the substrate; a mask, disposed over the photoresist layer with a gap therebetween; and a refraction element disposed over the mask so that a light beam from a light source is refracted by a specific angle.
Claims15
An inclined exposure lithography system for forming an optical film, the inclined exposure lithography system comprising:
- a substrate;
- a photoresist layer formed on the substrate;
- a mask, disposed over the photoresist layer with a gap therebetween;
- and
- a refraction element disposed over the mask so that a light beam from a light source is refracted by a specific angle.
2 more elements
Dependencies are inferred from the claim text.