System and method for test structure on a wafer

A method for testing a chip using a test structure in a temperature-controlled environment, wherein the chip and the test structure on a same substrate material, the method comprising:

• providing a top structure positioned above the chip, the top structure being characterized by a first surface area, the top structure including a first metal material occupying less than 60% of the surface area;
• providing a bottom structure positioned below the chip, the bottom structure being characterized by a second surface area, the second surface area being substantially equal to the first surface area, the bottom structure including a first silicon material, the first silicon material occupying substantially all of the second surface area;
• providing a first side structure positioned between the top structure and the bottom structure and located next to a first side of the chip, the first side structure being characterized by a first height, the first side structure including a second metal material;
• providing a second side structure positioned between the top structure and the bottom structure and located next to a second side of the chip, the second side structure being characterized by a second height, the second side structure including a third metal material;
• subjecting the chip and the test structure to the temperature control environment;
• and
• obtaining a plurality of data, the plurality of data being associated with the chip.

A test structure for testing a chip, wherein the test structure and the chip are manufactured on a same substrate material and the testing being conducted is in a temperature-controlled environment, the test structure comprising:

• a top structure positioned above the chip, the top structure including a first metal material, the first metal material including a first electrical terminal and a second electrical terminal;
• a bottom structure positioned below the chip, the bottom structure including a first silicon material;
• a first side structure positioned between the top structure and the bottom structure and located next to a first side of the chip, the first side structure being characterized by a first height, the first side structure including a second metal material;
• a second side structure positioned between the top structure and the bottom structure and located next to a second side of the chip, the second side structure being characterized by a second height, the second side structure including a third metal material.