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US 2010/0164115 A1Published application
Semiconductor chip package
OwnerJung-Hyun Yoinventor
Life of this patent
Estimating the term…
Abstract
A device and/or method relating to semiconductor technology. A semiconductor chip package may include dual line type input/output (I/O) pads. A semiconductor chip package may include a core area. A semiconductor chip package may include input/output (I/O) pads arranged on and/or over an outside of a core area, which may signal input/output to and/or from a core area. A semiconductor chip package may have input/output (I/O) pads including dual lines.
Claims20
An apparatus comprising:
- a core area;
- and
- input/output pads arranged over an outside of a core area configured to signal at least one of an input and an output to and from said core area.
A method comprising:
- forming a core area;
- and
- forming input/output pads arranged over an outside of a core area configured to signal at least one of an input and an output to and from said core area.
Dependencies are inferred from the claim text.