Inductor for semiconductor device and method for fabricating the same

An apparatus comprising:

• a wafer;
• a first metal pad formed on the wafer and having a surface exposed from the surface of the wafer;
• a second metal pad formed on the wafer and having a surface exposed from the surface of the wafer;
• a first inductor line formed in the wafer, the first inductor line comprising a first branch extending from the first metal pad in a first direction relative thereto, a second branch extending in a direction perpendicular to the first branch, and third and fourth branches extending from terminating ends of the second branch in a direction parallel to the first branch;
• and
• a second inductor line formed in the wafer, the second inductor line comprising a fifth branch extending from the second metal pad in a second direction relative thereto, a sixth branch extending in a direction perpendicular to the fifth branch, and seventh and eight branches extending from terminating ends of the sixth branch in a direction parallel to the fifth branch.

A method comprising:

• forming a photoresist pattern over a wafer;
• simultaneously forming a first plurality and a second plurality of trenches each having plurality of branches arranged in parallel in an alternating pattern by etching the wafer using the photoresist pattern as an etch mask;
• simultaneously forming first and second inductor lines by forming polysilicon in the trenches;
• and then
• forming a first metal pad at the wafer connected to the first inductor line and a second metal pad at the wafer connected to the second inductor line.