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US 2010/0163918 A1Published application
Led package
AssigneeSeoul Semiconductor Co., Ltd.
InventorsDo Hyung Kim, Suk Jin Kang
Life of this patent
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Abstract
The present invention relates to an LED package including a lead frame including a chip attaching portion with at least one LED chip attached thereto and a plurality of terminal portions each having a width narrower than the chip attaching portion, and a housing for supporting the lead frame. The plurality of terminal portions include at least one first terminal portion extending from a portion of a width of the chip attaching portion, and a plurality of second terminal portions spaced apart from the chip attaching portion.
Claims11
An LED package, comprising:
- a lead frame comprising a chip attaching portion comprising at least one LED chip attached thereto and a plurality of terminal portions each having a width narrower than the chip attaching portion;
- and
- a housing for supporting the lead frame,
- wherein the plurality of terminal portions comprise at least one first terminal portion extending from a portion of a width of the chip attaching portion, and a plurality of second terminal portions spaced apart from the chip attaching portion.
1 more element
Dependencies are inferred from the claim text.