US 2010/0163288 A1 · MULTILAYERED PRINTED CIRCUIT BOARD

Abstract

The present invention is to provide a multilayered printed circuit board free from cracks attributed to thermal expansion difference between a solder resist layer and another part and a multilayered printed circuit board of the present invention comprises a conductor circuit and a resin insulating layer serially formed on a substrate in an alternate fashion and in repetition and a solder resist layer formed as an outermost layer, and the solder resist layer contains an inorganic filler.

Claims7

Dependent claims

A multilayered printed circuit board comprising:

a conductor circuit and a resin insulating layer serially formed on a substrate in an alternate fashion and in repetition;
and a solder resist layer formed as an outermost layer,
wherein said solder resist layer is comprising a polyolefin type resin.

Dependencies are inferred from the claim text.

Facts

Application

12/685,190Filed 11 Jan 2010

Priority

JP 11/22885212 Aug 1999

Published

1 Jul 2010

Term ends

Not estimatedThe source records don’t support an estimate.

Classification3 codes

H05K 3/285
Applying non-metallic protective coatings: permanent coating compositions
H05K 3/4602
Manufacturing multilayer circuits: characterized by a special circuit board as base or central core whereon additional circuit layers are built or…
H05K
Printed circuits

Multilayered printed circuit board

Life of this patent

Multilayered printed circuit board

Life of this patent

Abstract

Claims7