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US 2010/0148334 A1Published application
Intergrated circuit package support system
AssigneeMicron Technology, Inc.
InventorsDavid J. Corisis, Walter L. Moden, Terry R. Lee
Life of this patent
Estimating the term…
Abstract
A system for supporting integrated circuit packages to prevent mechanical failure of the packages at their connection to a printed circuit board or card involves bracing the packages to the board or card, the packages may also be braced against one another. The structure is particularly well adapted to supporting vertical surface mount packages at a point spaced from the point where they connect to a printed circuit board or card.
Claims20
An electronic device, comprising:
- a plurality of integrated circuit packages;
- a contact surface electrically connected to each of said packages;
- and
- a support arranged to engage each of said packages at a point spaced above said surface to prevent movement of said packages relative to said surface, wherein said support comprises a post, wherein the post is directly connected to said surface.
1 more element
An electronic device, comprising:
- a plurality of integrated circuit packages connected to a surface;
- and
- at least one rail coupled to the surface, wherein the rail extends along the sides of the plurality of integrated circuit packages and is configured to only engage an opposed side edge of each of the plurality of integrated circuit packages.
An electronic device, comprising:
- a printed circuit board;
- a plurality of integrated circuit packages coupled to and vertically extending from a planar surface of the printed circuit board;
- a support arranged to engage each of said packages at a point spaced above said planar surface to prevent movement of said packages relative to said surface, wherein said support comprises two posts pluggingly engaged into the printed circuit board.
Dependencies are inferred from the claim text.