Method of Manufacturing a Semiconductor Device

A method of manufacturing a semiconductor device by performing divisional exposure on a predetermined area on a wafer, through two or more reticles, on each of which a mask pattern region is formed, the method comprising the steps of:

• arranging the reticles such that an outer most periphery of a field circle of exposure light incident on the wafer aligns with at least one side of the mask pattern region formed in the reticle;
• and
• exposing, to exposure light, the wafer, through the reticles arranged in the arranging step.

A method of manufacturing a semiconductor device by performing divisional exposure on a predetermined area on a wafer, by three exposures, one exposure for a center area of the predetermined area, and the other exposures for opposite sides of the center area, the method comprising the steps of:

• arranging three reticles, such that a width of a mask pattern formed for the exposure of the center area in one of the reticles is different from widths of the mask patterns formed in the other reticles in a direction along which the mask patterns of the three reticles are arranged;
• and
• exposing, to exposure light, the wafer, through the reticles arranged in the arranging step.

A method of manufacturing a semiconductor device by performing divisional exposure on a predetermined area on a wafer, through two or more reticles, on each of which a mask pattern region is formed, the method comprising the steps of:

• arranging the reticles such that areas of the mask pattern regions formed in the reticles are different from each other;
• and
• exposing, to exposure light, the wafer, through the reticles arranged in the arranging step.