Ic socket having positioning means for pick-up cap
AssigneeHon Hai Precision Industry Co., Ltd.
InventorFANG-JWU LIAO
Life of this patent
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AssigneeHon Hai Precision Industry Co., Ltd.
InventorFANG-JWU LIAO
Estimating the term…
An IC socket (1) for receiving an IC package includes a socket body (2), a plurality of contacts (3) received in the socket body (2), and a pick-up cap (4) mounted upon the socket body (2). The socket body (2) has a base section (20) and a plurality of side walls (21) extending upward from the base section (20). At least one side wall (21) defines a top surface (212), an inner surface (210), an outer surface (211) and a pair of datum projections (2100) extending inwardly from the inner surface (210). The side wall (21) with the datum projections (2100) includes a carrying surface (213) and an inclined surface (214) which are formed by excavating the top surface (212). The carrying surface (213) is lower than the top surface (212) for engaging with a carrying portion (400) formed on the pick-up cap (4). The inclined surface (214) is away from the datum projection (2100) with a selected distance therebetween.
An IC socket for receiving an IC package comprising:
An IC socket for receiving an IC package comprising:
An IC socket assembly comprising:
Dependencies are inferred from the claim text.