Substrate holding member, immersion type exposure device and method of fabricating semiconductor device

An immersion type exposure device, comprising:

• a substrate holding member having an opening inside which a substrate to be exposed is disposed, wherein an inner peripheral surface of the opening has a shape expanding toward a lower surface at least partly;
• a substrate stage on which the substrate holding member is disposed;
• and
• a controller for allowing an immersion area interposed between an end part of projection optics and the substrate to be exposed to move relatively to the substrate to be exposed and simultaneously, exposing emission areas of the substrate to be exposed covered with the immersion area.

A method of fabricating a semiconductor device, comprising:

• disposing a substrate holding member on a substrate stage, the substrate holding member having an opening inside which a substrate to be exposed is disposed, wherein an inner peripheral surface of the opening has a shape expanding toward a lower surface at least partly;
• inserting the substrate to be exposed having an external diameter smaller than the minimum internal diameter of the opening from above into the inside of the opening of the substrate holding member so as to dispose the substrate to be exposed on the substrate stage;
• and
• allowing an immersion area interposed between an end part of projection optics and the substrate to be exposed to move relatively to the substrate to be exposed and simultaneously, exposing emission areas of the substrate to be exposed covered with the immersion area.