Heat sink for an electronic device

A heat sink plate for an electronic device, wherein the heat sink plate comprises a thermally conductive material, wherein a first surface of the heat sink plate is protruded for contacting a surface of the electronic device, wherein the heat sink plate is corrugated in a direction perpendicular to the first surface of the heat sink plate.

A memory module comprising a clip and a plate of thermally conductive material, wherein a first surface of the plate is attached to a surface of the memory module, wherein the clip is arranged on a second surface of the plate, wherein two ends of the clip clasp the memory module and the plate at opposed edges of the memory module, wherein the clip presses the plate to the memory module.

An electronic system comprising a memory module, the memory module comprising a clip and a plate of thermally conductive material, wherein a first surface of the plate is attached to a surface of the memory module, wherein the clip is arranged on a second surface of the plate, wherein two ends of the clip clasp the memory module and the plate at opposed edges of the memory module, wherein the clip presses the plate to the memory module.

A heat sink plate for a memory module, wherein the heat sink plate comprises a thermally conductive material, wherein a first surface of the heat sink plate is protruded for contacting a surface of the memory module, wherein the heat sink plate is corrugated in a direction perpendicular to the first surface of the heat sink plate.

An electronic system comprising a memory module with a heat sink plate, wherein the heat sink plate comprises a thermally conductive material, wherein a first surface of the heat sink plate is protruded for contacting a surface of the memory module, wherein the heat sink plate is corrugated in a direction perpendicular to the first surface of the heat sink plate.