US 2009/0289307 A1Published application

Semiconductor device

AssigneeKabushiki Kaisha Toshiba

InventorHironobu Fukui

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Abstract

A semiconductor device according to one embodiment includes: a semiconductor substrate having a SRAM region; an N-type element region formed in the SRAM region on the semiconductor substrate and including N-type source/drain regions; a P-type element region formed in the SRAM region on the semiconductor substrate so as to be substantially parallel to the N-type element region and including P-type source/drain regions; P-type well contact connections and N-type well contact connections formed on both sides of the N-type and P-type element regions in a longitudinal direction outside the SRAM region on the semiconductor substrate, respectively; an element isolation region for isolating the N-type element region, the P-type element region, the P-type well contact connection and the N-type well contact connection; a P-type well continuously formed under the N-type element region and the P-type well contact connection in the semiconductor substrate, and an N-type well continuously formed under the P-type element region and the N-type well contact connection in the semiconductor substrate.

Claims20

Dependent claims

A semiconductor device, comprising:

a semiconductor substrate having a SRAM region;
an N-type element region formed in the SRAM region on the semiconductor substrate and including N-type source/drain regions;
a P-type element region formed in the SRAM region on the semiconductor substrate so as to be substantially parallel to the N-type element region and including P-type source/drain regions;
P-type well contact connections and N-type well contact connections formed on both sides of the N-type and P-type element regions in a longitudinal direction outside the SRAM region on the semiconductor substrate, respectively;
an element isolation region for isolating the N-type element region, the P-type element region, the P-type well contact connection and the N-type well contact connection;
a P-type well continuously formed under the N-type element region and the P-type well contact connection in the semiconductor substrate;
and
an N-type well continuously formed under the P-type element region and the N-type well contact connection in the semiconductor substrate;
wherein a depth from a surface of the semiconductor substrate in at least a portion of the P-type well on the P-type element region side under a first region is shallower than that in the P-type well under a third region, the first region is a region between the N-type element region and the closest P-type element region, and the third region is a region between the N-type element region and the P-type well contact connection;
wherein a depth from the surface of the semiconductor substrate in at least a portion of the N-type well on the N-type element region side under the first region and under a second region is shallower than that in the N-type well under a fourth region, the second region is a region which extends in the longitudinal direction from the first region within a range adjacent to the N-type element region, and the fourth region is between the P-type element region and the N-type well contact connection.

7 more elements

A semiconductor device, comprising:

a semiconductor substrate;
a first element region formed on the semiconductor substrate and including first source/drain regions having a first conductivity type;
a second element region formed on the semiconductor substrate so as to be substantially parallel to the first element region and including second source/drain regions having a second conductivity type that is different from the first conductivity type;
second well contact connections having the second conductivity type and first well contact connections having the first conductivity type formed on both sides of the first and second element regions in a longitudinal direction on the semiconductor substrate, respectively;
an element isolation region for isolating the first element region, the second element region, the second well contact connection and the first well contact connection;
a second well continuously formed under the first element region and the second well contact connection in the semiconductor substrate, and having the second conductivity type;
and
a first well continuously formed under the second element region and the first well contact connection in the semiconductor substrate, and having the first conductivity type;
wherein a depth from a surface of the semiconductor substrate in at least a portion of the second well on the second element region side under a first region is shallower than that in the second well under a region between the first element region and the second well contact connection, and the first region is a region between the first element region and the closest second element region;
wherein a depth from the surface of the semiconductor substrate in at least a portion of the first well on the first element region side under the first region and under a second region is shallower than that in the first well under a region between the second element region and the first well contact connection, and the second region is a region which extends in the longitudinal direction from the first region within a range adjacent to the first element region.

7 more elements

A semiconductor device, comprising:

a semiconductor substrate;
a P-type element region formed on the semiconductor substrate;
an N-type element region formed on the semiconductor substrate;
a P-type well contact connection formed on the semiconductor substrate;
an N-type well contact connection formed on the semiconductor substrate;
an element isolation region for isolating the P-type element region, the N-type element region, the P-type well contact connection and the N-type well contact connection;
a P-type well continuously formed under the N-type element region and the P-type well contact connection in the semiconductor substrate;
and
an N-type well continuously formed under the P-type element region and the N-type well contact connection in the semiconductor substrate;
wherein the P-type and N-type element regions are located closer than a predetermined distance from a boundary between the P-type and N-type wells;
a first depth from the surface of the semiconductor substrate in a region of the P-type well within the predetermined distance from the boundary is shallower than a depth from the surface of the semiconductor substrate in a region of the P-type well between the N-type element region and the P-type well contact connection;
and
a second depth from the surface of the semiconductor substrate in a region of the N-type well within the predetermined distance from the boundary is shallower than a depth from the surface of the semiconductor substrate in a region of the N-type well between the P-type element region and the N-type well contact connection.

10 more elements

Dependencies are inferred from the claim text.