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US 2009/0288803 A1Published application
Heat sink for chips
AssigneeCompTake Technology Inc.
InventorsWei-Hau Chen, Steven Yen
Life of this patent
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Abstract
A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped. A base board is connected on a top of the first heat dispensing unit and two engaging portions are connected to two ends of the base board. A second heat dispensing unit is fixed on a top of the base board. Two clamps connect the base board to the first heat dispensing unit. The second heat dispensing unit can be a fan, a water-cooling unit or an aluminum extruding member.
Claims9
A heat sink comprising:
- a first heat dispensing unit including multiple heat dispensing plates which are adapted to clamp chips therebetween;
- a base board having a contact surface defined in an underside of the base board, the contact surface being in contact with a top of the first heat dispensing unit and two engaging portions connected to two ends of the base board, a second heat dispensing unit fixed on a top of the base board, and
- two clamps connecting the base board to the first heat dispensing unit.
Dependencies are inferred from the claim text.