Positive photosensitive resin composition
AssigneesAsahi Kasei EMD Corporation, Pi R&D Co., Ltd.
InventorsTakayuki Kanada, Hiroyuki Hanahata, Xingzhou Jin, Shuzo Waki
Life of this patent
Estimating the term…
Abstract
A photosensitive resin composition comprising parts by mass of polycondensate (A) having a structure resulting from dehydration condensation between one or two or more tetracarboxylic acid dianhydride and one or two or more armatic diamines having mutually ortho-positioned amino and phenolic hydroxyl groups and 1 to 100 parts by mass of photosensitive diazonaphthoquinone compound (B), wherein the polycondensate (A) has a weight average molecular weight of 3000 to 70,000.
Claims9
A photosensitive resin composition comprising 1 to 100 parts by mass of a photosensitive diazonaphthoquinone compound (B) based on 100 parts by mass of a polycondensate (A), which has a structure formed from dehydration condensation of one or more tetracarboxylic dianhydrides and one or more aromatic diamines having an amino group and a phenolic hydroxyl group which are located at ortho positions with respect to each other, wherein the polycondensate (A) has a weight average molecular weight of 3,000 to 70,000.
Dependencies are inferred from the claim text.