Sputtering Method and Sputtering Apparatus, and Electronic Device Manufacturing Method

A method of sputtering a substrate by causing electric discharge in a vacuum container under a reduced pressure for a plurality of targets arranged to oppose the substrate, the method comprising the steps of:

• arranging the plurality of rectangular targets in the vacuum container equidistantly in a transport direction of the substrate such that distances between the plurality of rectangular targets and the substrate are different;
• and
• assuming that lengths of sides, parallel to the transport direction, of a first target and a second target that are adjacent, among the plurality of rectangular targets, are expressed as a first target width W1 and a second target width W2, respectively, and that a gap between a center point of the first target and a center point of the second target is expressed as L, when a relationship among the first target width W1, the second target width W2, and the gap L satisfies L≦3(W1+W2), and
• assuming that a distance from the center point of each of the plurality of targets to the substrate is expressed as T, performing sputtering such that a relationship between a longest distance Tmax among the distances of the plurality of targets to the substrate and the gap L at this time satisfies 0.4≦Tmax/L≦0.8.