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US 2009/0260865 A1Published application
Micro-electromechanical system
AssigneeHon Hai Precision Industry Co., Ltd.
InventorYi-Mou Huang
Life of this patent
Estimating the term…
Abstract
A micro-electromechanical system (MEMS) includes a micro-electromechanical chip, a printed circuit board and a metal wire. The metal wire electrically connects the micro-electromechanical chip and the printed circuit board. A connection distance and a connection angle are defined between the micro-electromechanical chip and the printed circuit board.
Claims16
A micro-electromechanical system (MEMS) comprising:
- a micro-electromechanical chip comprising a coverage area and a package area, wherein the micro-electromechanical chip is positioned between a first plastic protective surface and a second plastic protective surface;
- a printed circuit board spaced from the micro-electromechanical chip by a distance;
- and
- at least one metal wire electrically connecting the micro-electrical chip to the printed circuit board, wherein the at least one metal wire connects to an under bump metallization (UBM) disposed on a pad positioned on an area of the package area, and wherein the area of the package area is not covered by the first or second plastic protective surface.
1 more element
A micro-electromechanical system (MEMS) comprising:
- a micro-electromechanical chip comprising a coverage area and a package area, wherein the micro-electromechanical chip is positioned between a first plastic protective surface and a second plastic protective surface;
- a printed circuit board positioned perpendicular to the a micro-electromechanical chip and separated by a distance;
- and
- at least one metal wire electrically connecting the micro-electrical chip to the printed circuit board, wherein the at least one metal wire connects to an under bump metallization (UBM) disposed on a pad positioned on an area of the package area, and wherein the area of the package area is not covered by the first or second plastic protective surface.
1 more element
A micro-electromechanical system (MEMS) comprising:
- a micro-electromechanical chip comprising a coverage area and a package area, wherein the micro-electromechanical chip is positioned between a first plastic protective surface and a second plastic protective surface;
- a printed circuit board positioned parallel to the a micro-electromechanical chip and separated by a distance;
- and
- at least one metal wire electrically connecting the micro-electrical chip to the printed circuit board, wherein the at least one metal wire connects to an under bump metallization (UBM) disposed on a pad positioned on an area of the package area, and wherein the area of the package area is not covered by the first or second plastic protective surface.
1 more element
Dependencies are inferred from the claim text.