Passive Cooling In Response To Ambient Environmental Properties

A method for passively cooling an electronic component, said method comprising:

• placing a system for passively cooling the electronic component, wherein the system includes,
• a conduit configured to carry a pressurized cooling fluid, wherein the conduit includes a plurality of delivery orifices configured to dispense the pressurized cooling fluid from the conduit and cool the electronic component, and
• a hydrogel mechanism associated with each of the plurality of delivery orifices, wherein the hydrogel mechanism includes a hydrogel material configured to individually control the plurality of delivery orifices to regulate the dispensing of the cooling fluid from the delivery orifices automatically in response to a variation in a property of an ambient environment surrounding the hydrogel mechanism;
• and
• automatically regulating dispensing of the cooling fluid through the delivery orifice associated with the at least one hydrogel mechanism in response to a change in the property exceeding a predetermined level.