Electronic device packages and methods of formation
AssigneeRohm and Haas Electronic Materials LLC
InventorsJames W. Getz, David W. Sherrer, John J. Fisher
Life of this patent
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Abstract
Provided are electronic device packages and their methods of formation. The electronic device packages include an electronic device mounted on a substrate, a conductive via and a locally thinned region in the substrate. The invention finds application, for example, in the electronics industry for hermetic packages containing an electronic device such as an IC, optoelectronic or MEMS device.
Claims11
An electronic device package, comprising:
- a substrate having a first surface and a second surface opposite the first surface, wherein the second surface has a locally thinned region therein;
- a conductive via in the locally thinned region extending through the substrate to the first surface, wherein the conductive via and the locally thinned region each comprise a tapered sidewall, wherein the taper of the conductive via sidewall and of the locally thinned region sidewall are in the same direction;
- and
- an electronic device connected to the conductive via.
An electronic device package, comprising:
- a substrate having a first surface and a second surface opposite the first surface, wherein the second surface has a locally thinned region therein;
- a conductive via in the locally thinned region extending through the substrate to the first surface;
- an electronic device electrically connected to the conductive via;
- and
- a flex circuit disposed at least partially in the locally thinned region and electrically connected to the conductive via.
A method of forming an electronic device package, comprising:
- (a) providing a substrate having a first surface and a second surface opposite the first surface;
- (b) thinning a portion of the substrate from the second surface to form a locally thinned region in the second surface;
- (c) etching a via in the locally thinned region extending through the substrate, wherein the etching is conducted in a direction from the locally thinned surface to the first surface;
- (d) metallizing the via, wherein the conductive via and the locally thinned region each comprise a tapered sidewall, wherein the sidewall tapers of the conductive via and of the locally thinned region are in the same direction;
- and
- (e) providing an electronic device which is electrically connected to the conductive via.
A method of forming an electronic device package, comprising:
- (a) providing a substrate having a first surface and a second surface opposite the first surface;
- (b) thinning a portion of the substrate from the second surface to form a locally thinned region in the second surface;
- (c) forming a via in the locally thinned region extending through the substrate to the first surface;
- (d) metallizing the via;
- (e) providing an electronic device which is electrically connected to the conductive via;
- and
- (f) providing a flex circuit disposed at least partially in the locally thinned region and electrically connected to the conductive via.
Dependencies are inferred from the claim text.