Test socket with discrete guiding posts defining side walls
AssigneeHon Hai Precision Ind.Co., Ltd.
InventorWen-Yi Hsieh
Life of this patent
Estimating the term…
Abstract
A test socket, adapted for electrically connecting an IC package to a printed circuit board, comprises a bottom board (10) and four separated clumps (20). The bottom board has a main body (11) having a rectangular shape and four mounting portions (12) integrally extending outwardly from four corners of the main body, respectively. The clumps are assembled upon the four mounting portions of the bottom board to cooperate with the bottom board to define a receiving space for receiving the IC package.
Claims9
A test socket for electrically connecting an IC package to a printed circuit board, comprising:
- a bottom board having a main body with a substantially rectangular shape for loading the IC package thereon and four mounting portions integrally extending outwardly from four corners of the main body, respectively;
- and
- four separated clumps assembled onto the four mounting portions of the bottom board, respectively, the clump cooperating with the bottom board to define a receiving space for receiving the IC package.
A test socket for electrically connecting an IC package to a printed circuit board, comprising:
- a bottom board having a main body with a substantially rectangular shape for loading the package and a plurality of mounting portions integrally extending outwardly from four edges of the main body, respectively;
- and
- a plurality of separated clumps assembled upon the mounting portions of the bottom board, respectively, creating an imaginary sidewalls surrounding the main body of the bottom board, so that a receiving space for receiving the IC package is defined by the clumps together with the bottom board.
A socket for use with an IC package, comprising:
- an plastic bottom board defining a center main body with a plurality of mounting portions at different corners;
- and
- a metallic clumps individually attached to the mounting portions, respectively, each of said clumps defining an inward confining configuration so as to cooperate with one another to form a complete space for receiving the IC package;
- wherein
- each of the mounting portions is connected to the main body only via a radial direction so as to allow heat expansion of the main body freely.
Dependencies are inferred from the claim text.