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US 2009/0243085 A1Published application
Apparatus and method for attaching a heat dissipating device
OwnerSabina J. Houleinventor
Life of this patent
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Abstract
A microelectronic package is provided. The microelectronic package includes a heat dissipating device having a top side and a bottom side and a thermal interface material disposed adjacent to the bottom side of the heat dissipating device. The microelectronic package also includes a patterned metal layer comprising at least two metals disposed on the bottom side of the heat dissipating device, wherein the patterned metal layer is to adhere the heat dissipating device to the thermal interface material.
Claims20
A microelectronic package, comprising:
- a heat dissipating device having a top side and a bottom side;
- a thermal interface material disposed adjacent to the bottom side of the heat dissipating device;
- and
- a patterned metal layer comprising at least two metals, wherein the patterned metal layer is disposed on the bottom side of the heat dissipating device and wherein the patterned metal layer is to adhere the heat dissipating device to the thermal interface material.
1 more element
A method of forming a microelectronic package, comprising:
- providing a heat dissipating device having a top side and a bottom side;
- disposing a thermal interface material adjacent to the bottom side of the heat dissipating device;
- and
- plating the bottom side of the heat dissipating device with a patterned metal layer comprising at least two metals, wherein the patterned metal layer is to adhere the heat dissipating device to the thermal interface material.
1 more element
A microelectronic package, comprising:
- a die;
- a heat dissipating device having a top side and a bottom side coupled to the die;
- a thermal interface material disposed between the die and the heat dissipating device, wherein the thermal interface material is disposed adjacent to the bottom side of the heat dissipating device;
- and
- a patterned metal layer comprising at least two metals disposed on the bottom side of the heat dissipating device, wherein the patterned metal layer is to adhere the heat dissipating device to the thermal interface material.
2 more elements
Dependencies are inferred from the claim text.