Methods of depositing a silicon nitride film
AssigneeASM Genitech Korea Ltd.
InventorsTae Ho Yoon, Hyung Sang Park, Hak Yong Kwon, Young Jae Kim
Life of this patent
Estimating the term…
Loading patent…
AssigneeASM Genitech Korea Ltd.
InventorsTae Ho Yoon, Hyung Sang Park, Hak Yong Kwon, Young Jae Kim
Estimating the term…
Cyclical methods of depositing a silicon nitride film on a substrate are provided. In one embodiment, a method includes supplying a chlorosilane to a reactor in which a substrate is processed; supplying a purge gas to the reactor; and providing ammonia plasma to the reactor. The method allows a silicon nitride film to be formed at a low process temperature and a high deposition rate. The resulting silicon nitride film has a relatively few impurities and a relatively high quality. In addition, a silicon nitride film having good step coverage over features having high aspect ratios and a thin and uniform thickness can be formed.
A method of depositing a silicon nitride film, the method comprising:
A method of depositing a silicon nitride film, the method comprising:
An apparatus, comprising:
Dependencies are inferred from the claim text.