US 2009/0154109 A1Published application

Heat sink assembly

AssigneesHONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., Hon Hai Precision Industry Co., Ltd.

InventorsMING-KE CHEN, KE SUN, ZHEN-XING YE, XIAO-ZHU CHEN

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Abstract

A heat sink assembly includes a heat sink and a clip for securing the heat sink to a circuit board with a pair of securing members mounted thereon. The clip is a bent resilient wire including a positioning portion disposed on the heat sink and a pair of arms extending from opposite ends of the positioning portion. Each arm includes an operation portion suspended above the heat sink and a hook connecting with the operation portion. The securing members are located at opposite lateral sides of the electronic component respectively. The two hooks are configured for engaging with the securing members, correspondingly.

Claims7

Dependent claims

A heat sink assembly for cooling an electronic component mounted on a circuit board thereon, the heat sink assembly comprising:

a heat sink thermally contacted with the electronic component;
a clip securing the heat sink to the circuit board, the clip comprising a positioning portion disposed on the heat sink and a pair of resilient arms extending from opposite ends of the positioning portion, each arm comprising an operation portion suspended above the heat sink and a hook connecting with the operation portion;
and
a pair of securing members mounted on the circuit board at opposite lateral sides of the electronic component respectively and configured for engaging with the corresponding hooks of the clip.

1 more element

Dependencies are inferred from the claim text.