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US 2009/0154106 A1Published application
Double bonded heat dissipation
OwnerThomas W. Lynchinventor
Life of this patent
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Abstract
Embodiments described herein may include example embodiments of methods, apparatuses, devices, and/or systems for heat dissipation.
Claims20
An apparatus comprising:
- a substrate comprising a first surface, a second surface, and an aperture passing from the first surface to the second surface;
- a microelectronic component comprising a back surface and a front surface, the front surface of the microelectronic component coupled to the first surface of the substrate and located to cover the aperture of the substrate;
- and
- a heat dissipation device coupled to the back surface of the microelectronic component.
1 more element
A system comprising:
- a substrate comprising a first surface, a second surface, and an aperture passing from the first surface to the second surface;
- a microelectronic component comprising a back surface and a front surface, the front surface of the microelectronic component coupled to the first surface of the substrate and located to cover the aperture of the substrate;
- a heat dissipation device coupled to the back surface of the microelectronic component;
- a bus coupled to the microelectronic component;
- and
- a memory device coupled to the bus.
3 more elements
A method comprising:
- coupling a front surface of a microelectronic component to a first surface of a substrate located to cover an aperture passing from the first surface to a second surface of the substrate;
- and
- coupling a heat dissipation device to a back surface of the microelectronic component.
Dependencies are inferred from the claim text.