US 2009/0151921 A1 · HEAT SINK HAVING LOCKING DEVICE

Abstract

A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate fixed on the lower plate, and a plurality of heat pipes sandwiched between the lower plate and the upper plate. The lower plate includes a panel, a pair of sidewalls extending upwardly from two opposite sides of the panel, and a plurality of flanges extending upwardly from the sidewalls, respectively. The upper plate defines a plurality of cutouts corresponding to the flanges. The flanges fit into the cutouts to position the upper plate on the lower plate, whereby the lower plate and the upper plate are mechanically connected together.

Claims20

Dependent claims

A heat sink adapted for cooling an electronic component, comprising:

a lower plate comprising a panel, a pair of sidewalls extending upwardly from two opposite lateral sides of the panel, and a plurality of flanges extending upwardly from tops of the pair of sidewalls, respectively;
an upper plate defining a plurality of cutouts therein corresponding to the plurality of flanges;
and
a plurality of heat pipes sandwiched between the lower plate and the upper plate, wherein the plurality of flanges of the lower plate fit into the plurality of cutouts of the upper plate so that the lower plate and the upper are mechanically connected together.

1 more element

Dependencies are inferred from the claim text.

Heat sink having locking device

Life of this patent

Heat sink having locking device

Life of this patent

Abstract

Claims20