Method of forming passage in substrate for mems module
AssigneeLingsen Precision Industries, Ltd.
InventorsChiung-Yueh TIEN, Hsi-Chen YANG
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Abstract
A method of forming a passage in a substrate for a MEMS module is disclosed to include the steps of respectively forming a first support layer and a second support layer in a first space and a second space, which are respectively formed in a bottom side and a top side of a substrate by etching, by injection molding to define a sacrifice portion between the first and second support layers, and removing the sacrifice portion from the substrate by etching to form a passage defined between the first support layer and the second support layer in the substrate with two ends in communication with ambient atmosphere.
Claims8
A method of forming a passage in a substrate for a MEMS module, comprising the steps of:
- a) etching a substrate having a thickness smaller than 0.30 mm to form a first space in a bottom side of the substrate;
- b) forming a first support layer in first space of the substrate by means of injection molding;
- c) etching the substrate to form a second space in a top side of the substrate to define a sacrifice portion between the second space and the first support layer;
- d) forming a second support layer in the second space of the substrate by means of injection molding;
- and
- e) removing the sacrifice portion from the substrate by etching to form a passage defined between the first support layer and the second support layer in the substrate with two ends in communication with ambient atmosphere.
A method of forming a passage in a substrate for a MEMS module, comprising the steps of:
- a) etching a substrate having a thickness smaller than 0.30 mm to form a first space in a bottom side of the substrate;
- b) etching the substrate to form a second space in a top side of the substrate to define a sacrifice portion between the first space and the second space;
- c) forming a first support layer in the first space of the substrate by means of injection molding;
- d) forming a second support layer in second space of the substrate by means of injection molding;
- and
- e) removing the sacrifice portion from the substrate by etching to form a passage defined between the first support layer and the second support layer in the substrate with two ends in communication with ambient atmosphere.
Dependencies are inferred from the claim text.