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US 2009/0013933 A1Published application
Semiconductor manufacturing device
AssigneeT.T.S. S.R.L.
InventorsYou-Dong Lim, Jae-Ho Byun
Life of this patent
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Abstract
The present invention relates to a semiconductor manufacturing device that a maintenance or a repairing is easy so that an efficiency of manufacturing can be enhanced because a high temperature of a susceptor can be rapidly down. The present invention relates to a semiconductor manufacturing device that an efficiency of manufacturing can be enhanced because a heater for heating the semiconductor is heated by an external heating device.
Claims10
A semiconductor manufacturing device comprising:
- a susceptor body 11;
- a circular-typed cooling pipe 20 for circulating a cooling air having an inlet 21 for supplying a cooling air from an external supplying device to a susceptor body 11 and an outlet 22 for discharging the cooling air that circulated in the overall susceptor body 11 from the inlet 21;
- and
- a heater 30 for heating the body 1 I for keeping the temperature of the LCD,
- wherein said heater 30 is disposed at the lowest portion of the body 11 not to be contacted to the cooling pipe 20 by a first cover 31,
- wherein said cooling pipe 20 is disposed at the upper portion of the first cover 31 for covering the heater 30 and disposed to be complied to the position of the heater 30,
- wherein said cooling pipe 20 is disposed to be covered by a second cover 32, wherein said second cover 32 is disposed with a third cover 33 thereon for preventing the cooling air circulating in the cooling pipe 20 to be rapidly went up by the operation of the heater 30.
4 more elements
A semiconductor manufacturing device comprising:
- a sower head 40 for supplying a gas for manufacturing a semiconductor;
- a process chamber 50 for executing the process for manufacturing the semiconductor using the gas from the shower head 40;
- a vacuum line 60 for serving to extrude the gas occurred during the process for manufacturing the semiconductor;
- a dry pump 70 for pumping an air for depositing a film to the semiconductor (PE-CVD process) in the process chamber 50;
- a throttle valve 61 attached at the vacuum line 60 for controlling pressure of the air flowing to the vacuum line 60 from the process chamber 50;
- an isolation gate valve 62;
- a heating member 80 disposed in the process chamber 50 for heating the semiconductor;
- an external heating member 90 for supplying heating gas to the heating member 80 in the chamber 50;
- and
- a gas supplier 100 for supplying a gas to the external heating member 90.
7 more elements
Dependencies are inferred from the claim text.