US 2008/0304940 A1 · Integrated post-exposure bake track

Abstract

Systems and methods for processing wafers, a combined post expose bake and chill unit, and an interface are disclosed. An exemplary system includes a lithography tool, local track, transfer device, transfer device handler, interface unit, and controller to schedule processing. An exemplary combined post expose bake and chill unit includes an enclosure having an opening in its side, and a bake unit and a chill unit in the enclosure. An exemplary interface includes a plurality of enclosures arranged around robot(s) that transfer wafers among the enclosures, one of the plurality of enclosures being an integrated bake and chill unit.

Claims23

Dependent claims

A wafer processing system comprising:

a lithography tool;
a local track connected with the lithography tool;
a transfer device handler to handle a transfer device and transfer wafers from and to the transfer device;
an interface unit to transfer wafers between one or more of the transfer device handler and the lithography tool, the lithography tool and the local track, and the local track and transfer device handler;
and
a controller to schedule processing in the lithography tool, local track, interface unit and transfer device handler.

3 more elements

Dependencies are inferred from the claim text.

Integrated post-exposure bake track

Life of this patent

Integrated post-exposure bake track

Life of this patent

Abstract

Claims23