Vertical Tunneling Transistor
AssigneeMicron Technology, Inc.
InventorGurtej S. Sandhu
Life of this patent
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Abstract
The disclosed embodiments relate to a vertical tunneling transistor that may include a channel disposed on a substrate. A quantum dot may be disposed so that an axis through the channel and the quantum dot is substantially perpendicular to the substrate. A gate may be disposed so that an axis through the channel, the quantum dot and the gate is substantially perpendicular to the substrate.
Claims22
An electronic device, comprising:
- a memory device that receives information stored on the storage device, the memory device comprising:
- a substrate;
- a plurality of access transistors, each of the plurality of access transistors comprising:
- a channel formed on the substrate;
- a self-aligned island of conductive material formed such that the channel is between the island of conductive material and the substrate;
- a gate formed such that the island of conductive material is between the gate and the channel;
- and
- wherein an axis through the channel, the island of conductive material, and the gate is substantially perpendicular to an upper surface of the substrate;
- and
- a memory array including a plurality of memory cells formed on the substrate, each of the plurality of memory cells comprising of a memory element coupled to one of the plurality of access transistors.
A memory device, comprising:
- a memory element disposed on a substrate;
- and
- an access device coupled to the memory element, the access device comprising:
- a channel formed on the substrate;
- an island of conductive material formed such that an axis through the channel and the island of conductive material is substantially perpendicular to the substrate;
- and
- a gate formed such that an axis through the channel, the island of conductive material and the gate is substantially perpendicular to the substrate.
An integrated circuit device, comprising:
- a substrate;
- and
- a memory array that includes a plurality of memory cells disposed on the substrate, each of the plurality of memory cells comprising a memory element and an access transistor, the access transistor comprising:
- a channel disposed on the substrate;
- a self-aligned island of conductive material disposed so that the channel is between the island of conductive material and the substrate;
- a gate disposed so that the island of conductive material is between the gate and the channel;
- and
- wherein an axis through the channel, the island of conductive material, and the gate is substantially perpendicular to an upper surface of the substrate.
A device comprising:
- a memory element disposed on a substrate, and
- an access device coupled to the memory element, the access device comprising:
- a channel disposed on the substrate;
- an island of conductive material disposed so that the channel is between the island of conductive material and the substrate;
- a gate disposed so that the island of conductive material is between the gate and the channel;
- and
- wherein an axis through the channel, the island of conductive material, and the gate is substantially perpendicular to an upper surface of the substrate.
A vertical tunneling transistor, the vertical tunneling transistor produced by the process of:
- disposing a channel on a substrate;
- disposing a dielectric layer on the substrate;
- providing an aperture with a sidewall in the dielectric layer;
- disposing a spacer adjacent the sidewall in the aperture that reduces a dimension of the aperture that is substantially parallel to the substrate to a sub-photolithographic size;
- disposing an island of conductive material within the aperture so that an axis through the channel and the island of conductive material is substantially perpendicular to the substrate;
- and
- providing a gate so that an axis through the channel, the island of conductive material and the gate is substantially perpendicular to the substrate.
A memory device, comprising:
- a memory element formed on a substrate;
- and
- an access device coupled to the memory element, the access device comprising:
- a channel formed on the substrate;
- a self-aligned island of conductive material formed such that the channel is between the island of conductive material and the substrate;
- a gate formed such that the island of conductive material is between the gate and the channel;
- and
- wherein an axis through the channel, the island of conductive material, and the gate is substantially perpendicular to an upper surface of the substrate.
Dependencies are inferred from the claim text.