US 2008/0293340 A1Published application

Methods and apparatus for removal of films and flakes from the edge of both sides of a substrate using backing pads

AssigneeApplied Materials, Inc.

InventorsEashwer Kollata, Shou-Sung Chang, Zhenhua Zhang, Paul D. Butterfield, Sen-Hou Ko, Antoine P. Manens, Gary C. Ettinger, Ricardo Martinez

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Abstract

Apparatus and methods are provided to polish an edge of a substrate. The invention includes a polishing head adapted to retain a backing pad having a selected contour, wherein the polishing head is adapted to press the backing pad against an edge of a substrate. Numerous other aspects are provided.

Claims25

Dependent claims

An apparatus for polishing an edge of a substrate comprising:

a backing pad coupled to a polishing head, wherein the backing pad has a selected contour, and wherein the polishing head is adapted to press the backing pad against an edge of a substrate.

Dependencies are inferred from the claim text.

Facts

Application: 12/124,142Filed 20 May 2008
Priority: 21 May 2007
Published: 27 Nov 2008
Term ends: Not estimatedThe source records don’t support an estimate.

Classification4 codes

B24B 9/065
Of non-metallic inorganic material, e.g. stone, ceramics, porcelain: of thin, brittle parts, e.g. semiconductors, wafers
H10P 70/54
Characterised by the part to be cleaned: cleaning of wafer edges
B24B
Machines, devices, or processes for grinding or polishing
H10P
Generic processes or apparatus for the manufacture or treatment of devices covered

Family

Application60/939,342Us provisional application · filed 21 May 2007
US 8,142,260 B2Related patent
US 2008/0293340 A1This patent

From the US filing history. Foreign family members aren’t listed.

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