Polishing composition and polishing method
AssigneeFujimi Incorporated
InventorsMasayuki HATTORI, Hideyuki Satoh, Atsunori Kawamura
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Abstract
To provide a polishing composition which is suitable particularly for an application to polish a wafer containing tungsten, and a polishing process employing such a polishing composition. The polishing composition of the present invention comprises a colloidal silica and hydrogen peroxide. The pH of the polishing composition is from 5 to 8.5, and the concentration of iron ions in the polishing composition is at most 0.02 ppm. The polishing composition preferably further contains phosphoric acid or a phosphate.
Claims5
A polishing composition comprising a colloidal silica and hydrogen peroxide and having a pH of from 5 to 8.5 and a concentration of iron ions in the polishing composition being at most 0.02 ppm.
Dependencies are inferred from the claim text.