Packaging for low-cost, high-performance mircowave and millimeter wave modules

An assembly comprising;

• a structure having an Indentation for accepting a module, said indentation bounded on one side by a printed circuit board;
• said module comprising:
• a baseplate having a microwave or millimeter wave component attached thereto;
• a substantially planar transition board having a first connector attached to a first side of said board and operatively connected to said component and a second connector attached to a second side of said board and operatively connected to said component through said board;
• and
• a first cover wherein said first cover and said baseplate form a cavity containing said board and said component;
• and
• a second cover,
• wherein said module is disposed within said indentation such that said second connector is operatively connected to said printed circuit board, and
• wherein said second cover and said structure enclose said module.

A communication system operating in a predetermined frequency range comprising:

• a plurality of assemblies, at least one assembly comprising:
• a structure having an indentation for accepting a module, said indentation bounded on one side by a printed circuit board;
• said module comprising:
• a baseplate having a microwave or millimeter wave component attached thereto:
• a substantially planar transition board having a first connector attached to a first side of said board and operatively connected to said component, and a second connector attached to a second side of said board and operatively connected to said component through said board;
• and
• a first cover wherein said first cover and said baseplate form a cavity containing said hoard and said component;
• and
• a second cover,
• wherein said module is disposed within said indentation such that said second connector is operatively connected to said printed circuit board, and
• wherein said second cover and said structure enclose said module.

A method for eliminating feed-throughs in an assembly comprising the steps of;

• providing a structure having an indentation for accepting a module, said indentation bounded on one side by a printed circuit board;
• operatively connecting a module to the printed circuit board, the module comprising:
• a baseplate having a microwave or millimeter wave component attached thereto;
• a substantially planar transition board having a first connector attached to a first side of said board and operatively connected to said component, and a second connector attached to a second side of said board and operatively connected to said component through said board, said connectors providing a direct connection without a wire or cable;
• and
• a first cover wherein said first cover and said baseplate form a cavity containing said board and said component;
• and
• removably attaching a second cover to the structure to enclose the module,
• wherein power and signal connectors to the module are not attached to either the baseplate or the cover.